Log in or Register for enhanced features | Forgotten Password?
White Papers | Suppliers | Events | Report Store | Companies | Dining Club | Videos
Specialized Packaging
Household & Electronics Products
Return to: PKBR Home | Specialized Packaging | Household & Electronics Products

Kulicke & Soffa to showcase new ball bonding solutions at SEMICON Taiwan

PKBR Staff Writer Published 12 September 2017

Kulicke & Soffa plans to launch its new GEN-S Series of ball bonding solutions at this week’s Taiwanese microelectronics event dubbed as SEMICON Taiwan 2017 in Taipei.

Based in Singapore, Kulicke & Soffa provides semiconductor packaging and electronic assembly solutions for automotive, consumer, communications, computing and industrial customers across the world.

The Singapore firm will also use the microelectronics event to highlight some of its other leading solutions targeting the emerging industrial, automotive and advanced packaging markets.

Kulicke & Soffa will be unveiling Rapid Pro, which it says is the first in its new GEN-S Series of ball bonders designed for high performance.

The Singaporean firm says that the new ball bonder comes with advanced process capabilities, real-time monitoring and diagnostics to guarantee high quality and efficient assembly serving automotive applications. Rapid Pro also has high-reliability semiconductor applications, says Kulicke & Soffa.

Kulicke & Soffa ball bonder business line & strategic solutions development vice president Nelson Wong said: “Our latest GEN-S series highlights our continuous focus on research and development to deliver value-added solutions with unparalleled performance to our customers.”

Also lined up to be introduced at the Taiwanese microelectronics event by Kulicke & Soffa are Asterion, ATPremier PLUS and Hybrid with Horizontal Wafer Feeder solutions.

Asterion, as per its manufacturer, is a hybrid wedge bonder with an enhanced capability. It is particularly useful for advanced interconnect materials as it can provide an expanded bond area having strong pattern recognition capabilities and exceptionally tight process controls.

ATPremier, on the other hand, is claimed to be a versatile wafer level bonder capable of delivering high wafer-level stud bumping along with increased productivity and efficiency.

Kulicke & Soffa has revealed that Hybrid with Horizontal Wafer Feeder is an innovative solution which is useful for bulk System-in-Package (SiP), die-attach, flip-chip and wafer-level-package manufacturing.